szhylpcb888@126.com
86-755-27330794
szhylpcb888@126.com
86-755-27330794
|
项目
Item
|
实验条件
Test condition
|
单位
Unit
|
典型值 Index | ||
| HYL-001 | HYL-002 | HYL-003 | |||
|
热传导率
Thermal
Conductivity
|
A |
W/m.k | 2.5 - 5.0 | 1.5 - 2.0 | 1.5 - 2.0 |
|
剥离强度
Peel Strength
|
A
热应力后
（After thermal stress)
|
N/mm |
1.3
1.3
|
1.3
1.3
|
1.3
1.3
|
|
热应力
Thermal stress
|
288℃
不分层不起泡
No-separation
No- bubbles
|
S | 120S | 120S | 600S |
|
表面电阻
Surface Resistivity
|
C-96/35/90
E-24/125
|
ΜΩ |
107
105
|
107
105
|
107
105
|
|
体积电阻率
Volume Resistivity
|
C-96/35/90
E-24/125
|
ΜΩ-mm |
107
105
|
107
105
|
107
105
|
|
电气强度
Electrical strength
|
A | KV/mm | 30 | 30 | 30 |
|
燃烧性
Flammability
|
UL94 | _ _ | V- 0 | V- 0 | V- 0 |
| Tg | A | ℃ | 100 | 170 | 170 |
|
吸水率
Moisture absorption
|
D- 24/23 | % | 0.03 | 0.03 | 0.03 |
| CTI | TEC60112 | V | 600 | 600 | 600 |
|
击穿电压
Breakdown voltage
|
A | _ _ | 4KV(AC) | 5KV(AC) | 6KV(AC) |
